Exploration 1C:
How is Chemistry used
to build ICs?: Making a Capacitor
This animation illustrates
the processes involved in building a capacitor on top of
a doped silicon wafer. The movie is designed
for easy click through of the frames individually.
Process Steps for a Discrete Capacitor
Clicking on the text
links will take you to the Glossary for more information about
the term.
  - Begin with Doped
  Silicon Substrate
  
 - Grow Oxide
  Layer
  
 - Apply Photoresist
  Polymer
  
 - Place Mask
  over Chip
  
 - Expose Areas to be
  Removed to Light
  
 - Remove Mask
  
 - Wash Away Exposed
  Photoresist
  
 - Etch Oxide
  
 - Deposit Conductors
  
 - Remove Remaining
  Photoresist
 
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Glossary
  - Doped Silicon Substrate
  
-  
  
  - Silicon's conductivity
  for the capacitor substrate is enhanced by "doping"
  or inserting other atoms into the crystal matrix. In p-doped
  silicon, atoms such as boron with 3 valence electrons are inserted
  into the crystal. The "p" designation comes from the
  holes (or missing electrons) resulting from having atoms present
  with 3 valence electrons instead of silicon's four valence electrons.
  In n-doped silicon, atoms with five valence electrons,
  such as phosphorus, are added resulting in extra electrons present
  relative to when all the atoms were silicon. Back
  
 - Oxide Layer
  
-  
  
  - The most common insulator
  used in microelectronics is silicon dioxide glass. Silicon dioxide
  is a very poor conductor and can be grown on the wafer simply
  by heating it in oxygen. Back
  
 - Photoresist Polymer
  
-  
  
  - The photoresist polymer
  is a very thin coating of polymer (similar to nail polish) applied
  to the wafer surface which will react with light to create areas
  which are soluble in different solvents. By removing selected
  areas of the photoresist, those areas of the wafer are available
  for reactions and modifications while the rest of the wafer is
  protected. Back
  
 - Mask
  
-  
  
  - The mask is a very
  elaborate template which shields the areas of the photoresist
  that are needed for protection and allows light to penetrate
  to the photoresist to be removed. Back
  
 - Light
  
-  
  
  - The light used to
  initiate transformations in the photoresist polymer is usually
  ultraviolet light. For the type of photoresist polymer illustrated
  here, the light initiates bond-breaking so that the exposed areas
  can be easily washed away. Back
  
 - Conductors
  
-  
  
  - The conductors in
  microelectronics are generally formed from deposited conducting
  metal such as aluminum. Back
 
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